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Fuway Tech has been committed to the promotion and sales of electronic components for many years

NEWS CENTER

Fuway Tech has been committed to the promotion and sales of electronic components for many years

What factors can cause crystal vibration damage?

Time: 2024-01-29 14:47:16

1. There is a falling phenomenon in the production process, which means that only the crystal oscillator causes too much impact from the outside world, because the crystal oscillator chip is relatively thin and needs to be handled lightly. 2, when the crystal vibration is welded to the circuit board, the welding temperature may be too high, resulting in poor crystal vibration.

1. There is a falling phenomenon in the production process, which means that only the crystal oscillator causes too much impact from the outside world, because the crystal oscillator chip is relatively thin and needs to be handled lightly.

2, when the crystal vibration is welded to the circuit board, the welding temperature may be too high, resulting in poor crystal vibration.

3, the welding process produces virtual welding, that is, false welding, so that the crystal vibration is not electrified.

4, after the crystal vibration welding, the solder is connected to the line, resulting in short circuit phenomenon.

5, in the leak detection process, that is, under the environment of alcohol pressure, the quartz crystal resonator is easy to produce shell phenomenon, that is, the chip and the shell are easy to touch when vibrating, so that the crystal is easy to lose or stop vibration when vibrating;

During the compression sealing, the internal crystal is required to be vacuumed and filled with nitrogen. If the compression sealing is poor, that is, when the seal of the crystal is not good, under the condition of alcohol compression, it appears as air leakage, called double leakage, which will also lead to vibration stop.

6, high-frequency crystal vibration, because the thickness of the chip itself is very thin, when the excitation power is too large, it will damage the internal quartz chip, resulting in vibration stop;

7, the functional load will reduce the Q value (that is, the quality factor), so that the stability of the crystal is reduced, easy to be affected by the surrounding active components, in an unstable state, when the vibration is sluggish phenomenon;

8, because the crystal is easy to produce mechanical stress and thermal stress when cutting feet and soldering, and the solder temperature is too high and the action time is too long will affect the crystal, which is easy to lead to the crystal in a critical state, and even the phenomenon of depression when the vibration occurs, and even the vibration stops;

9, when the crystal frequency frequency drift, and beyond the quartz crystal vibration deviation range is too much, so that the central frequency of the crystal can not be captured, resulting in chip vibration


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